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Microchip Technology PIC24HJ64GP502-I/SP Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 64KB FLASH 28SPDIP

11,319 ActiveMicrochip Technology28-DIP (0.300", 7.62mm)RoHS
PIC24HJ64GP502-I/SP 28-DIP (0.300", 7.62mm) package illustration

Same model may have multiple batches, images only for reference.

PIC24HJ64GP502-I/SP
Part Number (MPN)
PIC24HJ64GP502-I/SP
Detailed Description
IC MCU 16BIT 64KB FLASH 28SPDIP
Package
28-DIP (0.300", 7.62mm)
Key Features
Package / Case: 28-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF PIC24HJ64GP502-I/SP Datasheet
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Technical Specifications

Microchip Technology PIC24HJ64GP502-I/SP Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
8K x 8
RoHS
Yes
Package / Case
28-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O
21
Speed
40 MIPs

Related Parts Comparison (PIC24HJ64GP502-I/SP vs PIC16C57-10I/SP vs PIC16LC57C-04I/SP vs PIC16C57-10/SP)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case28-DIP28-DIP28-DIP28-DIP
Mounting TypeThrough HoleThrough HoleThrough HoleThrough Hole
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)0°C ~ 70°C (TA)
Supply Voltage3V ~ 3.6V4.5V ~ 5.5V2.5V ~ 5.5V4.5V ~ 5.5V
Core ProcessorPICPICPICPIC
Core Size16-Bit8-Bit8-Bit8-Bit
RAM Size8K x 872 x 872 x 872 x 8
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
Number of I/O21202020
Oscillator TypeInternalExternalExternalExternal
PackageSPDIP-28SPDIP-28SPDIP-28SPDIP-28
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