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Microchip Technology PIC18LC242-I/SP Microcontroller, Microprocessor, FPGA Modules

IC MCU 8BIT 16KB OTP 28SPDIP

12,048Microchip Technology28-DIP (0.300", 7.62mm)RoHS
PIC18LC242-I/SP - No Image Available

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PIC18LC242-I/SP
Part Number (MPN)
PIC18LC242-I/SP
Detailed Description
IC MCU 8BIT 16KB OTP 28SPDIP
Package
28-DIP (0.300", 7.62mm)
Key Features
Package / Case: 28-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF PIC18LC242-I/SP Datasheet
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Technical Specifications

Microchip Technology PIC18LC242-I/SP Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
512 x 8
Package / Case
28-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.5V ~ 5.5V
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O
22
Speed
40MHz
Core Processor
PIC
Program Memory Type
OTP

Alternate Parts Comparison (PIC18LC242-I/SP vs PIC16C57-10I/SP vs PIC16LC57C-04I/SP vs PIC16C57-10/SP)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case28-DIP28-DIP28-DIP28-DIP
Mounting TypeThrough HoleThrough HoleThrough HoleThrough Hole
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)0°C ~ 70°C (TA)
Supply Voltage2.5V ~ 5.5V4.5V ~ 5.5V2.5V ~ 5.5V4.5V ~ 5.5V
Core ProcessorPICPICPICPIC
Core Size8-Bit8-Bit8-Bit8-Bit
RAM Size512 x 872 x 872 x 872 x 8
Number of I/O22202020
Oscillator TypeExternalExternalExternalExternal
PeripheralsBrown-out Detect/Reset, LVD, POR, PWM, WDTPOR, WDTPOR, WDTPOR, WDT
Program Memory Size16KB (8K x 16)3KB (2K x 12)3KB (2K x 12)3KB (2K x 12)
Program Memory TypeOTPOTPOTPOTP
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