Microchip Technology PIC16LC58B-04/P Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 3KB OTP 18DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
PIC16LC58B-04/P
Detailed Description
IC MCU 8BIT 3KB OTP 18DIP
Package
18-DIP (0.300, 7.62mm)
Key Features
Package / Case: 18-DIP (0.300, 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PIC16LC58B-04/P Datasheet
Quick Jump:
Technical Specifications
Microchip Technology PIC16LC58B-04/P Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
PIC® 16C
RAM Size
73 x 8
RoHS
Yes
Package / Case
18-DIP
Mounting Type
Through Hole
Operating Temperature
0°C ~ 70°C (TA)
Supply Voltage
2.5V ~ 5.5V
Lifecycle Status
Active
Peripherals
POR, WDT
Speed
4MHz
Alternate Parts Comparison (PIC16LC58B-04/P vs PIC16F1937-I/PT vs PIC16LF1823T-I/ML vs PIC16F883-E/ML)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 18-DIP | 44-TQFP | 16-VQFN Exposed Pad | 28-VQFN Exposed Pad |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 2.5V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 3.6V | 2V ~ 5.5V |
| Core Processor | PIC | PIC | PIC | PIC |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 73 x 8 | 512 B | 128 x 8 | 256 x 8 |
| RoHS | Yes | Compliant | Yes | Yes |
| Lifecycle Status | Active | Production | Active | Active |
| Number of I/O | 12 | 36 | 12 | 24 |
| Oscillator Type | External | Internal | Internal | Internal |
| Package | PDIP-18 | TQFP | QFN-16 | QFN-28 |
| Action |
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