Microchip Technology PIC12CE673-04I/P Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 1.75KB OTP 8DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
PIC12CE673-04I/P
Detailed Description
IC MCU 8BIT 1.75KB OTP 8DIP
Package
8-DIP (0.300, 7.62mm)
Key Features
Package / Case: 8-DIP (0.300, 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PIC12CE673-04I/P Datasheet
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Technical Specifications
Microchip Technology PIC12CE673-04I/P Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
PIC® 12C
RAM Size
128 x 8
Package / Case
8-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3V ~ 5.5V
Peripherals
POR, WDT
Speed
4MHz
Core Processor
PIC
Numberof IO
5
Alternate Parts Comparison (PIC12CE673-04I/P vs PIC16F1937-I/PT vs PIC16LF1823T-I/ML vs PIC16F883-E/ML)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 8-DIP | 44-TQFP | 16-VQFN Exposed Pad | 28-VQFN Exposed Pad |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) |
| Supply Voltage | 3V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 3.6V | 2V ~ 5.5V |
| Core Processor | PIC | PIC | PIC | PIC |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 128 x 8 | 512 B | 128 x 8 | 256 x 8 |
| Data Converters | A/D 4x8b | A/D 14x10b | A/D 8x10b | A/D 11x10b |
| EEPROM Size | 16 x 8 | 256 x 8 | 256 x 8 | 256 x 8 |
| Oscillator Type | Internal | Internal | Internal | Internal |
| Peripherals | POR, WDT | Brown-out Detect/Reset, I2C, LCD, POR, PWM, WDT | Brown-out Detect/Reset, POR, PWM, WDT | Brown-out Detect/Reset, POR, PWM, WDT |
| Program Memory Size | 1.75KB (1K x 14) | 14KB (8K x 14) | 3.5KB (2K x 14) | 7KB (4K x 14) |
| Action |
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