Microchip Technology PCX755BVZFU350LE Microcontroller, Microprocessor, FPGA Modules
IC MPU POWERPC 350MHZ 360BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
PCX755BVZFU350LE
Detailed Description
IC MPU POWERPC 350MHZ 360BGA
Package
360-BBGA Exposed Pad
Key Features
Package / Case: 360-BBGA Exposed Pad
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PCX755BVZFU350LE Datasheet
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Technical Specifications
Microchip Technology PCX755BVZFU350LE Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Package / Case
360-BBGA Exposed Pad
Operating Temperature
-40°C ~ 110°C (TJ)
Voltage IO
2.5V, 3.3V
Speed
350MHz
Core Processor
PowerPC
Number of Cores Bus Width
1 Core, 32-Bit
Graphics Acceleration
No
Alternate Parts Comparison (PCX755BVZFU350LE vs PCX8240VTPU200EZD3 vs PCX8240VTPU200E vs PCX755BVZFU300LE)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 360-BBGA Exposed Pad | 352-LBGA | 352-LBGA | 360-BBGA Exposed Pad |
| Operating Temperature | -40°C ~ 110°C (TJ) | -40°C ~ 110°C (TJ) | -40°C ~ 110°C (TJ) | -40°C ~ 110°C (TJ) |
| Core Processor | PowerPC | PowerPC 603e | PowerPC 603e | PowerPC |
| Graphics Acceleration | No | No | No | No |
| Number of Cores Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 350MHz | 200MHz | 200MHz | 300MHz |
| Voltage IO | 2.5V, 3.3V | 3.3V | 3.3V | 2.5V, 3.3V |
| Action |
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