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Microchip Technology PCX755BVZFU350LE Microcontroller, Microprocessor, FPGA Modules

IC MPU POWERPC 350MHZ 360BGA

1,381 ActiveMicrochip Technology360-BBGA Exposed PadRoHS
PCX755BVZFU350LE 360-BBGA Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

PCX755BVZFU350LE
Part Number (MPN)
PCX755BVZFU350LE
Detailed Description
IC MPU POWERPC 350MHZ 360BGA
Package
360-BBGA Exposed Pad
Key Features
Package / Case: 360-BBGA Exposed Pad
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF PCX755BVZFU350LE Datasheet
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Technical Specifications

Microchip Technology PCX755BVZFU350LE Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RoHS
Yes
Number of Pins
360
Package / Case
360-BBGA Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 110°C (TJ)
Lifecycle Status
Active
Voltage IO
2.5V, 3.3V
Speed
350MHz
Core Processor
PowerPC
Number of Cores Bus Width
1 Core, 32-Bit

Alternate Parts Comparison (PCX755BVZFU350LE vs PCX8240VTPU200EZD3 vs PCX8240VTPU200E vs PCX755BVZFU300LE)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case360-BBGA Exposed Pad352-LBGA352-LBGA360-BBGA Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 110°C (TJ)-40°C ~ 110°C (TJ)-40°C ~ 110°C (TJ)-40°C ~ 110°C (TJ)
Core ProcessorPowerPCPowerPC 603ePowerPC 603ePowerPC
RoHSYesYesYesYes
Lifecycle StatusActiveObsoleteObsoleteObsolete
Graphics AccelerationNoNoNoNo
Number of Cores Bus Width1 Core, 32-Bit1 Core, 32-Bit1 Core, 32-Bit1 Core, 32-Bit
PackageBBGA-360352-LBGA352-LBGA360-BBGAExposedPad
Speed350MHz200MHz200MHz300MHz
Voltage IO2.5V, 3.3V3.3V3.3V2.5V, 3.3V
Action

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