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Microchip Technology PCX745BVZFU300LE Microcontroller, Microprocessor, FPGA Modules

IC MPU POWERPC 300MHZ 255BGA

1,855Microchip Technology255-BBGA Exposed PadRoHS
PCX745BVZFU300LE 255-BBGA Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

PCX745BVZFU300LE
Part Number (MPN)
PCX745BVZFU300LE
Detailed Description
IC MPU POWERPC 300MHZ 255BGA
Package
255-BBGA Exposed Pad
Key Features
Package / Case: 255-BBGA Exposed Pad
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF PCX745BVZFU300LE Datasheet
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Technical Specifications

Microchip Technology PCX745BVZFU300LE Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RoHS
Yes
Package / Case
255-BBGA Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 110°C (TJ)
Lifecycle Status
Obsolete
Voltage IO
2.5V, 3.3V
Speed
300MHz
Core Processor
PowerPC
Number of Cores Bus Width
1 Core, 32-Bit
Graphics Acceleration
No

Alternate Parts Comparison (PCX745BVZFU300LE vs PCX8240VTPU200EZD3 vs PCX8240VTPU200E vs PCX745BVZFU350LE)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case255-BBGA Exposed Pad352-LBGA352-LBGA255-BBGA Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 110°C (TJ)-40°C ~ 110°C (TJ)-40°C ~ 110°C (TJ)-40°C ~ 110°C (TJ)
Core ProcessorPowerPCPowerPC 603ePowerPC 603ePowerPC
RoHSYesYesYesYes
Lifecycle StatusObsoleteObsoleteObsoleteObsolete
Graphics AccelerationNoNoNoNo
Number of Cores Bus Width1 Core, 32-Bit1 Core, 32-Bit1 Core, 32-Bit1 Core, 32-Bit
Package255-BBGA Exposed Pad352-LBGA352-LBGA255-BBGA Exposed Pad
Speed300MHz200MHz200MHz350MHz
Voltage IO2.5V, 3.3V3.3V3.3V2.5V, 3.3V
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