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Microchip Technology MCP23S08-E/P Microcontrollers

IC XPNDR 10MHZ SPI 18DIP

8,000 ActiveMicrochip TechnologyMCP23S18-DIP (0.300", 7.62mm)$3.30
MCP23S08-E/P 18-DIP (0.300", 7.62mm) package illustration

Same model may have multiple batches, images only for reference.

MCP23S08-E/P
Part Number (MPN)
MCP23S08-E/P
Base Model
Detailed Description
IC XPNDR 10MHZ SPI 18DIP
Package
18-DIP (0.300", 7.62mm)
Lifecycle Status
Active
Datasheet
PDF MCP23S08-E/P Datasheet
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Ordering Code Family

MCP23S groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

9 ordering variants listed on the family page.

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Technical Specifications

Microchip Technology MCP23S08-E/P Microcontrollers technical specifications.

General

Interface
SPI
Maximum Clock Frequency
10 MHz
RoHS
Yes
Package / Case
18-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 125°C
Supply Voltage
1.8V ~ 5.5V
Lifecycle Status
Active
Features
POR
Output Type
Push-Pull

Alternate Parts Comparison (MCP23S08-E/P vs MCP23S18-E/SO vs MCP23S18T-E/MJ vs MCP23S09-E/MG)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case18-DIP28-SOIC24-VFQFN Exposed Pad16-VFQFN Exposed Pad
Mounting TypeThrough HoleSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C-40°C ~ 125°C-40°C ~ 125°C-40°C ~ 125°C
Supply Voltage1.8V ~ 5.5V1.8V ~ 5.5V1.8V ~ 5.5V1.8V ~ 5.5V
InterfaceSPISPISPISPI
Maximum Clock Frequency10 MHz10 MHz10 MHz10 MHz
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
Clock Frequency10 MHz10 MHz10 MHz10 MHz
Current Output Source Sink25mA25mA25mA25mA
Esd ProtectionWithout ESD ProtectionWithout ESD ProtectionWithout ESD Protection4 kV
Interface TypeSerial, SPISerial, SPISerial, SPISerial, SPI
Action

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