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Microchip Technology LE57D111BTCT Telecom

IC TELECOM INTERFACE 44TQFP

19,499Microchip Technology44-TQFP Exposed PadRoHS
LE57D111BTCT 44-TQFP Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

LE57D111BTCT
Part Number (MPN)
LE57D111BTCT
Detailed Description
IC TELECOM INTERFACE 44TQFP
Package
44-TQFP Exposed Pad
Key Features
Package / Case: 44-TQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF LE57D111BTCT Datasheet
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Technical Specifications

Microchip Technology LE57D111BTCT Telecom technical specifications.

General

RoHS
Yes
Package / Case
44-TQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
4.75V ~ 5.25V
Lifecycle Status
Obsolete
Current Supply
9mA
Functions
Subscriber Line Interface Concept (SLIC)
Number of Circuits
2
Moisture Sensitive
Yes

Alternate Parts Comparison (LE57D111BTCT vs LE9502BTCT vs LE9502BTC vs LE9642PQCT)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case44-TQFP Exposed Pad44-TQFP Exposed Pad44-TQFP Exposed Pad48-VFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C-40°C ~ 85°C-40°C ~ 85°C-40°C ~ 85°C
Supply Voltage4.75V ~ 5.25V3.3V3.3V3.135V ~ 3.465V
Lifecycle StatusObsoleteObsoleteObsoleteActive
Number of Circuits2112
RoHSYes--YesYes
PackageLQFP EP-44--44-TQFP Exposed PadVQFN-48
Interface--2-Wire2-Wire4-Wire
Function--Subscriber Line Interface Concept (SLIC)Subscriber Line Interface Concept (SLIC)Subscriber Line Interface Concept (SLIC)
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