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Microchip Technology DSPIC33CK256MC502-E/M6 Microcontroller, Microprocessor, FPGA Modules

DSPIC33C 100MHZ, 256KB FLASH, 32

1,469 ActiveMicrochip Technology28-UFQFN Exposed PadRoHS
DSPIC33CK256MC502-E/M6 - No Image Available

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DSPIC33CK256MC502-E/M6
Part Number (MPN)
DSPIC33CK256MC502-E/M6
Detailed Description
DSPIC33C 100MHZ, 256KB FLASH, 32
Package
28-UFQFN Exposed Pad
Key Features
Package / Case: 28-UFQFN Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF DSPIC33CK256MC502-E/M6 Datasheet
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Technical Specifications

Microchip Technology DSPIC33CK256MC502-E/M6 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Package / Case
28-UFQFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3V ~ 3.6V
Core Processor
dsPIC
Program Memory Type
Flash
Core Size
16-Bit
Program Memory Size
256KB (256K x 8)
Oscillator Type
Internal

Alternate Parts Comparison (DSPIC33CK256MC502-E/M6 vs PIC16LF15386-I/MV vs PIC16LF18855T-I/MV vs PIC16LF15356T-I/MV)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case28-UFQFN Exposed Pad28-UFQFN Exposed Pad28-UFQFN Exposed Pad28-UFQFN Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage3V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V1.8V ~ 3.6V
Core ProcessordsPICPICPICPIC
Core Size16-Bit8-Bit8-Bit8-Bit
Oscillator TypeInternalInternalInternalInternal
Program Memory Size256KB (256K x 8)28KB (16K x 14)14KB (8K x 14)28KB (16K x 14)
Program Memory TypeFlashFlashFlashFlash
RAM Size--2K x 81K x 82K x 8
Connectivity--I²C, LINbus, SPI, UART/USARTI²C, LINbus, SPI, UART/USARTI²C, LINbus, SPI, UART/USART
Data Converters--A/D 43x10b; D/A 1x5bA/D 24x10b; D/A 1x5bA/D 24x10b; D/A 1x5b
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