Microchip Technology DSPIC30F3012-30I/P Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 24KB FLASH 18DIP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DSPIC30F3012-30I/P
Detailed Description
IC MCU 16BIT 24KB FLASH 18DIP
Package
18-DIP (0.300", 7.62mm)
Key Features
Package / Case: 18-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
DSPIC30F3012-30I/P Datasheet
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Technical Specifications
Microchip Technology DSPIC30F3012-30I/P Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
2K x 8
Package / Case
18-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.5V ~ 5.5V
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
12
Speed
30 MIPs
EEPROM Size
1K x 8
Core Processor
dsPIC
Alternate Parts Comparison (DSPIC30F3012-30I/P vs MIC58P42YN vs PIC16LC54A-04I/P vs PIC16LC56A-04I/P)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 18-DIP | 18-DIP | 18-DIP | 18-DIP |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole |
| Operating Temperature | -40°C ~ 85°C (TA) | -55°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 2.5V ~ 5.5V | -- | 3V ~ 6.25V | 2.5V ~ 5.5V |
| Core Processor | dsPIC | -- | PIC | PIC |
| Core Size | 16-Bit | -- | 8-Bit | 8-Bit |
| RAM Size | 2K x 8 | -- | 25 x 8 | 25 x 8 |
| Number of I/O | 12 | -- | 12 | 12 |
| Oscillator Type | Internal | -- | External | External |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT | -- | POR, WDT | POR, WDT |
| Program Memory Size | 24KB (8K x 24) | -- | 768B (512 x 12) | 1.5KB (1K x 12) |
| Program Memory Type | Flash | -- | OTP | OTP |
| Action |
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