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Microchip Technology DSPIC30F2011-20E/P Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 12KB FLASH 18DIP

2,674 ActiveMicrochip Technology18-DIP (0.300", 7.62mm)RoHS
DSPIC30F2011-20E/P - No Image Available

Same model may have multiple batches, images only for reference.

DSPIC30F2011-20E/P
Part Number (MPN)
DSPIC30F2011-20E/P
Detailed Description
IC MCU 16BIT 12KB FLASH 18DIP
Package
18-DIP (0.300", 7.62mm)
Key Features
Package / Case: 18-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF DSPIC30F2011-20E/P Datasheet
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Technical Specifications

Microchip Technology DSPIC30F2011-20E/P Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
1K x 8
Package / Case
18-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.5V ~ 5.5V
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
12
Speed
20 MIPS
Core Processor
dsPIC
Program Memory Type
Flash

Alternate Parts Comparison (DSPIC30F2011-20E/P vs MIC58P42YN vs PIC16CE623-20I/P vs PIC16CE625-20I/P)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case18-DIP18-DIP18-DIP18-DIP
Mounting TypeThrough HoleThrough HoleThrough HoleThrough Hole
Operating Temperature-40°C ~ 125°C (TA)-55°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.5V ~ 5.5V--3V ~ 5.5V3V ~ 5.5V
Core ProcessordsPIC--PICPIC
Core Size16-Bit--8-Bit8-Bit
RAM Size1K x 8--96 x 8128 x 8
Number of I/O12--1313
Oscillator TypeInternal--ExternalExternal
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT--Brown-out Detect/Reset, POR, WDTBrown-out Detect/Reset, POR, WDT
Program Memory Size12KB (4K x 24)--896B (512 x 14)3.5KB (2K x 14)
Program Memory TypeFlash--OTPOTP
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