Microchip Technology ATSAMA5D27C-LD1G-CU Microcontroller, Microprocessor, FPGA Modules
CORTEX-A5 MPU 1GBIT LPDDR2 BGA I
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
ATSAMA5D27C-LD1G-CU
Detailed Description
CORTEX-A5 MPU 1GBIT LPDDR2 BGA I
Package
361-TFBGA
Key Features
Package / Case: 361-TFBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
ATSAMA5D27C-LD1G-CU Datasheet
Quick Jump:
Technical Specifications
Microchip Technology ATSAMA5D27C-LD1G-CU Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
SAMA5D2
RAM Size
1 Gbit
Data Bus Width
32 bit
Maximum Clock Frequency
500 MHz
RoHS
Yes
Package / Case
361-TFBGA
Mounting Type
SMD/SMT
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
1.8 V
Lifecycle Status
Active
Alternate Parts Comparison (ATSAMA5D27C-LD1G-CU vs ATSAMA5D29-CNR vs ATSAMA5D29-CN vs ATSAMA5D27C-CUR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 361-TFBGA | 289-LFBGA | 289-LFBGA | 289-LFBGA |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) |
| Core Processor | ARM® Cortex®-A5 | ARM® Cortex®-A5 | ARM® Cortex®-A5 | ARM® Cortex®-A5 |
| Co Processors DSP | Multimedia; NEON™ MPE | Multimedia; NEON™ MPE | Multimedia; NEON™ MPE | Multimedia; NEON™ MPE |
| Display and Interface Controllers | Keyboard, LCD, Touchscreen | LCD, Touchscreen | LCD, Touchscreen | Keyboard, LCD, Touchscreen |
| Ethernet | 10/100Mbps (1) | 10/100Mbps (1) | 10/100Mbps (1) | 10/100Mbps (1) |
| Graphics Acceleration | Yes | Yes | Yes | Yes |
| Number of Cores Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit |
| RAM Controllers | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | DDR2, DDR3, DDR3L, LPDDR, LPDDR2, LPDDR3 | DDR2, DDR3, DDR3L, LPDDR, LPDDR2, LPDDR3 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | AES, ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure Memory, Secure RTC, SHA, TDES, TRNG | AES, ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure Memory, Secure RTC, SHA, TDES, TRNG | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC |
| Speed | 500MHz | 500MHz | 500MHz | 500MHz |
| USB | USB 2.0 + HSIC | USB (3)+ HSIC (3) | USB (3)+ HSIC (3) | USB 2.0 + HSIC |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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