Microchip Technology ATSAMA5D27C-D1G-CUR Microcontroller, Microprocessor, FPGA Modules
BGA GREEN, IND TEMP,MRLC,1GBIT D
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
ATSAMA5D27C-D1G-CUR
Detailed Description
BGA GREEN, IND TEMP,MRLC,1GBIT D
Package
289-TFBGA
Key Features
Package / Case: 289-TFBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
ATSAMA5D27C-D1G-CUR Datasheet
Quick Jump:
Technical Specifications
Microchip Technology ATSAMA5D27C-D1G-CUR Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RoHS
Yes
Package / Case
289-TFBGA
Operating Temperature
-40°C ~ 85°C (TA)
Lifecycle Status
Active
Voltage IO
3.3V
Speed
500MHz
Core Processor
ARM® Cortex®-A5
Number of Cores Bus Width
1 Core, 32-Bit
Co Processors DSP
Multimedia; NEON™ MPE
RAM Controllers
LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI
Alternate Parts Comparison (ATSAMA5D27C-D1G-CUR vs ATSAMA5D29-CNR vs ATSAMA5D29-CN vs ATSAMA5D27C-CUR)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 289-TFBGA | 289-LFBGA | 289-LFBGA | 289-LFBGA |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) |
| Core Processor | ARM® Cortex®-A5 | ARM® Cortex®-A5 | ARM® Cortex®-A5 | ARM® Cortex®-A5 |
| Co Processors DSP | Multimedia; NEON™ MPE | Multimedia; NEON™ MPE | Multimedia; NEON™ MPE | Multimedia; NEON™ MPE |
| Display and Interface Controllers | Keyboard, LCD, Touchscreen | LCD, Touchscreen | LCD, Touchscreen | Keyboard, LCD, Touchscreen |
| Ethernet | 10/100Mbps (1) | 10/100Mbps (1) | 10/100Mbps (1) | 10/100Mbps (1) |
| Graphics Acceleration | Yes | Yes | Yes | Yes |
| Number of Cores Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit |
| RAM Controllers | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | DDR2, DDR3, DDR3L, LPDDR, LPDDR2, LPDDR3 | DDR2, DDR3, DDR3L, LPDDR, LPDDR2, LPDDR3 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | AES, ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure Memory, Secure RTC, SHA, TDES, TRNG | AES, ARM TZ, Boot Security, Cryptography, Secure JTAG, Secure Memory, Secure RTC, SHA, TDES, TRNG | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC |
| Speed | 500MHz | 500MHz | 500MHz | 500MHz |
| USB | USB 2.0 + HSIC | USB (3)+ HSIC (3) | USB (3)+ HSIC (3) | USB 2.0 + HSIC |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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