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Microchip Technology ATPL230AG55J19-Y Microcontroller, Microprocessor, FPGA Modules

PL230A-AKU-Y SAMG55J19A-MU LQFP

14,856 ActiveMicrochip TechnologyRoHS
ATPL230AG55J19-Y package illustration

Same model may have multiple batches, images only for reference.

ATPL230AG55J19-Y
Part Number (MPN)
ATPL230AG55J19-Y
Detailed Description
PL230A-AKU-Y SAMG55J19A-MU LQFP
Key Features
Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF ATPL230AG55J19-Y Datasheet
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Technical Specifications

Microchip Technology ATPL230AG55J19-Y Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Interface
SPI
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
3V ~ 3.6V
Lifecycle Status
Active
Core Processor
External
Applications
Power Line Communications

Alternate Parts Comparison (ATPL230AG55J19-Y vs ATPL220A-A1U-Y vs ATPL00B-AZU-Y vs ATPL210A-A1U-Y)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Lifecycle StatusActiveObsoleteObsoleteObsolete
Operating Temperature-40°C ~ 85°C---40°C ~ 85°C-40°C ~ 85°C
Supply Voltage3V ~ 3.6V--3V ~ 3.6V3V ~ 3.6V
InterfaceSPI--SPI, UARTSPI, UART
Core ProcessorExternal--ADD8051C3AADD8051C3A
ApplicationsPower Line Communications--Power Line CommunicationsPower Line Communications
Package / Case--120-LQFP144-LQFP120-LQFP
Package--120-LQFPLQFP-144LQFP-120
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