Microchip Technology AT91SAM9G25-BFU Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 64KB ROM 247VFBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
AT91SAM9G25-BFU
Detailed Description
IC MCU 32BIT 64KB ROM 247VFBGA
Package
247-VFBGA
Key Features
Package / Case: 247-VFBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
AT91SAM9G25-BFU Datasheet
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Technical Specifications
Microchip Technology AT91SAM9G25-BFU Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
SAM9G
RAM Size
32K x 8
RoHS
Yes
Package / Case
247-VFBGA
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
0.9 V ~ 1.1 V
Lifecycle Status
Active
Voltage IO
1.8V, 3.3V
Speed
400MHz
Core Processor
ARM926EJ-S
Related Parts Comparison (AT91SAM9G25-BFU vs AT24C02D-SSHM-T vs AT24C16C-SSHM-T vs AT24C256C-SSHL-T)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 247-VFBGA | 8-SOIC | 8-SOIC | 8-SOIC |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TC) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 0.9 V ~ 1.1 V | 1.7V ~ 3.6V | 1.7V ~ 5.5V | 1.7V ~ 5.5V |
| RoHS | Yes | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Production | Production | Production |
| Package | VFBGA-247 | SOIC | SOIC | SOIC |
| Mounting Type | -- | Surface Mount | Surface Mount | Surface Mount |
| Memory Size | -- | 256 B | 2 kB | 32 kB |
| Interface | -- | 2-Wire, I2C | 2-Wire, I2C | 2-Wire, I2C |
| Number of Pins | -- | 8 | 8 | 8 |
| Access Time | -- | 900 ns | 450 ns | 550 ns |
| Address Bus Width Bit | -- | 3 | 3 | 15 |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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