Microchip Technology AT89S8253-24PU Microcontroller, Microprocessor, FPGA Modules
IC MCU 8BIT 12KB FLASH 40DIP

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
AT89S8253-24PU
Detailed Description
IC MCU 8BIT 12KB FLASH 40DIP
Package
40-DIP (0.600", 15.24mm)
Key Features
Package / Case: 40-DIP (0.600", 15.24mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
Quick Jump:
Technical Specifications
Microchip Technology AT89S8253-24PU Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
256 x 8
RoHS
True
Number of Pins
44
Package / Case
40-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
POR, WDT
Number of I/O
32
Alternate Parts Comparison (AT89S8253-24PU vs AT89LV55-12PC vs AT89LP51RD2-20PU vs AT90S8515-4PC)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 40-DIP | 40-DIP | 40-DIP | 40-DIP |
| Mounting Type | Through Hole | Through Hole | Through Hole | Through Hole |
| Operating Temperature | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C |
| Supply Voltage | 2.7V ~ 5.5V | 2.7V ~ 6V | 2.4V ~ 5.5V | 2.7V ~ 6V |
| Core Processor | 8051 | 8051 | 8051 | AVR |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| RAM Size | 256 x 8 | 256 x 8 | 2.25K x 8 | 512 x 8 |
| Connectivity | SPI, UART/USART | UART/USART | EBI/EMI, I²C, SPI, UART/USART | SPI, UART/USART |
| Number of I/O | 32 | 32 | 37 | 32 |
| Oscillator Type | External | Internal | Internal | Internal |
| Program Memory Size | 12KB (12K x 8) | 20KB (20K x 8) | 64KB (64K x 8) | 8KB (4K x 16) |
| Program Memory Type | Flash | Flash | Flash | Flash |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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