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Microchip Technology 23LCV512-E/ST Memory Integrated Circuit

IC SRAM 512KBIT SPI/DL 8TSSOP

4,458Microchip Technology8-TSSOP (0.173", 4.40mm Width)RoHS
23LCV512-E/ST - No Image Available

Same model may have multiple batches, images only for reference.

23LCV512-E/ST
Part Number (MPN)
23LCV512-E/ST
Detailed Description
IC SRAM 512KBIT SPI/DL 8TSSOP
Package
8-TSSOP (0.173", 4.40mm Width)
Key Features
Package / Case: 8-TSSOP (0.173", 4.40mm Width); Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF 23LCV512-E/ST Datasheet
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Technical Specifications

Microchip Technology 23LCV512-E/ST Memory Integrated Circuit technical specifications.

General

Memory Size
512Kb (64K x 8)
Maximum Clock Frequency
20
RoHS
Compliant
Number of Pins
8
Package / Case
8-TSSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.5V ~ 5.5V
Lifecycle Status
Obsolete
Technology
SRAM - Synchronous

Alternate Parts Comparison (23LCV512-E/ST vs 23LCV1024-I/ST vs 23LCV512-I/ST vs 23LC1024-E/ST)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case8-TSSOP8-TSSOP8-TSSOP8-TSSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)
Supply Voltage2.5V ~ 5.5V2.5V ~ 5.5V2.5V ~ 5.5V2.5V ~ 5.5V
Memory Size512Kb (64K x 8)1 Mbit512Kbit1 Mbit
Number of Pins8888
RoHSCompliantCompliantCompliantCompliant
Lifecycle StatusObsoleteActiveActiveActive
Address Bus Width Bit16241624
AutomotiveNoNoNoYes
Data Rate ArchitectureSDRSDRSDRSDR
Max Access Time Ns25252532
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