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Microchip Technology 23LC512-E/P Memory Integrated Circuit

IC SRAM 512KBIT SPI/QUAD 8DIP

4,638 ActiveMicrochip Technology8-DIP (0.300", 7.62mm)RoHS
23LC512-E/P - No Image Available

Same model may have multiple batches, images only for reference.

23LC512-E/P
Part Number (MPN)
23LC512-E/P
Detailed Description
IC SRAM 512KBIT SPI/QUAD 8DIP
Package
8-DIP (0.300", 7.62mm)
Key Features
Package / Case: 8-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF 23LC512-E/P Datasheet
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Technical Specifications

Microchip Technology 23LC512-E/P Memory Integrated Circuit technical specifications.

General

Memory Size
512Kb (64K x 8)
RoHS
Compliant
Number of Pins
8
Package / Case
8-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.5V ~ 5.5V
Lifecycle Status
Active
Technology
SRAM
Memory Type
Volatile

Alternate Parts Comparison (23LC512-E/P vs 23LCV1024-E/P vs 23A512-E/P vs 23A1024-E/P)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case8-DIP8-DIP8-DIP8-DIP
Mounting TypeThrough HoleThrough HoleThrough HoleThrough Hole
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage2.5V ~ 5.5V2.5V ~ 5.5V1.7V ~ 2.2V1.7V ~ 2.2V
Memory Size512Kb (64K x 8)1Mb (128K x 8)512Kb (64K x 8)1Mb (128K x 8)
Number of Pins8888
RoHSCompliantCompliantCompliantCompliant
Lifecycle StatusActiveObsoleteActiveActive
Address Bus Width Bit16241624
AutomotiveYesNoYesYes
Data Rate ArchitectureSDRSDRSDRSDR
Max Access Time Ns32253232
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