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Macronix MX25L1655DXCI-10G Flash Memory

Flash, 4MX4, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, MO-216, TFBGA-24

20,400 ActiveMacronixMXSMIO™$4.86RoHS
MX25L1655DXCI-10G package illustration

Same model may have multiple batches, images only for reference.

MX25L1655DXCI-10G
Manufacturer
Part Number (MPN)
MX25L1655DXCI-10G
Series
Detailed Description
Flash, 4MX4, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, MO-216, TFBGA-24
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MX25L1655DXCI-10G Datasheet
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Technical Specifications

Macronix MX25L1655DXCI-10G Flash Memory technical specifications.

General

Interface
FLASH
RoHS
Yes
Number of Pins
24
Operating Temperature
-40 ~ 85
Supply Voltage
3.3
Terminal Position
BOTTOM
Jedec Package Code
R-PBGA-B24
Width
6
Length
8
Number of Functions
1

Related Parts Comparison (MX25L1655DXCI-10G vs MX25U3232FBHI02 vs MX25L1006EZUI-10G vs MX25L1606EZNI-12G)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Operating Temperature-40 ~ 85-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supply Voltage3.31.65V ~ 2V3.6V3.6V
RoHSYesROHS3 CompliantYesYes
InterfaceFLASH--SPI, SerialSPI, Serial
Number of Pins24--88
Number of Words4194304--1M/512K16M/8M
Temperature GradeINDUSTRIAL--INDUSTRIALINDUSTRIAL
Series--MXSMIO™MX25xxx05/06/08MX25xxx05/06
Package / Case--12-XFBGA, WLCSP8-UFDFN Exposed Pad8-WDFN Exposed Pad
Mounting Type--Surface MountSurface MountSurface Mount
Memory Size--32 Mbit1Mb16Mb (2M x 8)
Lifecycle Status--ActiveNot For New DesignsNot For New Designs
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