Intel 10M04SAU169C8G FPGAs (Field Programmable Gate Array)
IC FPGA 130 I/O 169UBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
10M04SAU169C8G
Category
Detailed Description
IC FPGA 130 I/O 169UBGA
Package
169-LFBGA
Key Features
Package: 169-LFBGA; Supply Voltage: 2.85V ~ 3.465V
Lifecycle Status
Active
Datasheet
10M04SAU169C8G Datasheet
Quick Jump:
Technical Specifications
Intel 10M04SAU169C8G FPGAs (Field Programmable Gate Array) technical specifications.
General
RoHS
Yes
Package / Case
169-LFBGA
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C (TJ)
Supply Voltage
2.85V ~ 3.465V
Lifecycle Status
Active
Package
169-LFBGA
Number of I/O
130
Number of LABs/CLBs
250
Number of Logic Elements Cells
4000
Alternate Parts Comparison (10M04SAU169C8G vs 10M02SCU169A7G vs 10M02SCU169C8G vs EP4CE40F23I7)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 169-LFBGA | 169-LFBGA | 169-LFBGA | 484-BGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 125°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Supply Voltage | 2.85V ~ 3.465V | 2.85V ~ 3.465V | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Number of I/O | 130 | 130 | 130 | 328 |
| Number of LABs/CLBs | 250 | 125 | 125 | 2475 |
| Number of Logic Elements Cells | 4000 | 2000 | 2000 | 39600 |
| Package | 169-LFBGA | 169-LFBGA | 169-LFBGA | 484-BGA |
| Total RAM Bits | 193536 | 110592 | 110592 | 1161216 |
| Series | -- | MAX 10 10M02 | MAX 10 10M02 | EP4CE40 Cyclone IV E |
| Action |
More Parts in FPGAs (Field Programmable Gate Array)
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.
