Infineon Technologies XE167FH200F100LABFXUMA1 Microcontroller, Microprocessor, FPGA Modules
IC MCU 16BIT 1.56MB FLSH 144LQFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XE167FH200F100LABFXUMA1
Detailed Description
IC MCU 16BIT 1.56MB FLSH 144LQFP
Package
144-LQFP Exposed Pad
Key Features
Package / Case: 144-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Not For New Designs
RoHS State
RoHS Compliant
Datasheet
XE167FH200F100LABFXUMA1 Datasheet
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Technical Specifications
Infineon Technologies XE167FH200F100LABFXUMA1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
138K x 8
Package / Case
144-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Not For New Designs
Peripherals
I²S, POR, PWM, WDT
Number of I/O
118
Speed
100MHz
Core Processor
C166SV2
Related Parts Comparison (XE167FH200F100LABFXUMA1 vs TC264D40F200NBCKXUMA2 vs TC334LP32F200FAAKXUMA1 vs XMC4500-F144F1024AB)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) |
| Supply Voltage | 3V ~ 5.5V | 3.3V, 5V | 3.3V, 5V | 3.13V ~ 3.63V |
| Core Processor | C166SV2 | TriCore™ | TriCore™ | ARM® Cortex®-M4 |
| Core Size | 16-Bit | 32-Bit Dual-Core | 32-Bit Single-Core | 32-Bit |
| RAM Size | 138K x 8 | 240K x 8 | 248K x 8 | 160K x 8 |
| Lifecycle Status | Not For New Designs | Active | Active | Active |
| Connectivity | CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI | ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT | ASC, CANbus, FlexRay, LINbus, QSPI | CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG |
| Oscillator Type | Internal | External | Internal | Internal |
| Peripherals | I²S, POR, PWM, WDT | DMA, WDT | DMA, I²S, PWM, WDT | DMA, I²S, LED, POR, PWM, WDT |
| Program Memory Size | 1.56MB (1.56M x 8) | 2.5MB (2.5M x 8) | 2MB (2M x 8) | 1MB (1M x 8) |
| Program Memory Type | Flash | Flash | Flash | Flash |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
Suggested replacements
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