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Infineon Technologies XC2331D12F66LAAKFUMA1 Microcontroller, Microprocessor, FPGA Modules

IC MCU 16/32BIT 96KB FLASH

14,466Infineon Technologies64-LQFP Exposed PadRoHS
XC2331D12F66LAAKFUMA1 - No Image Available

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XC2331D12F66LAAKFUMA1
Part Number (MPN)
XC2331D12F66LAAKFUMA1
Detailed Description
IC MCU 16/32BIT 96KB FLASH
Package
64-LQFP Exposed Pad
Key Features
Package / Case: 64-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF XC2331D12F66LAAKFUMA1 Datasheet
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Technical Specifications

Infineon Technologies XC2331D12F66LAAKFUMA1 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
12K x 8
Package / Case
64-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3V ~ 5.5V
Peripherals
DMA, I²S, POR, PWM, WDT
Number of I/O
49
Speed
66MHz
Core Processor
C166SV2
Program Memory Type
Flash

Alternate Parts Comparison (XC2331D12F66LAAKFUMA1 vs XC2236N40F66LAAFXUMA1 vs XC2331D20F66LRAAKXUMA1 vs TLE9180D31QKXUMA1)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case64-LQFP Exposed Pad64-LQFP Exposed Pad64-LQFP Exposed Pad64-LQFP Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)-40°C ~ 150°C (TJ)
Supply Voltage3V ~ 5.5V3V ~ 5.5V3V ~ 5.5V5.5V ~ 60V
Core ProcessorC166SV2C166SV2C166SV2--
Core Size16/32-Bit16/32-Bit16/32-Bit--
RAM Size12K x 842K x 812K x 8--
ConnectivityCANbus, EBI/EMI, I²C, LINbus, SPI, UART/USARTCANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USICANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART--
Data ConvertersA/D 10x12bA/D 9x10bA/D 10x12b--
Number of I/O493849--
Oscillator TypeInternalInternalInternal--
PeripheralsDMA, I²S, POR, PWM, WDTI²S, POR, PWM, WDTDMA, I²S, POR, PWM, WDT--
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