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Infineon Technologies TC356TA64F300SABKXUMA1 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 4MB FLASH 180LFBGA

10,203 ActiveInfineon Technologies180-LFBGARoHS
TC356TA64F300SABKXUMA1 180-LFBGA package illustration

Same model may have multiple batches, images only for reference.

TC356TA64F300SABKXUMA1
Part Number (MPN)
TC356TA64F300SABKXUMA1
Detailed Description
IC MCU 32BIT 4MB FLASH 180LFBGA
Package
180-LFBGA
Key Features
Package / Case: 180-LFBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF TC356TA64F300SABKXUMA1 Datasheet
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Technical Specifications

Infineon Technologies TC356TA64F300SABKXUMA1 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
3.578K x 8
Package / Case
180-LFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3.3V, 5V
Lifecycle Status
Active
Peripherals
DMA, I²S, LVDS, PWM, WDT
Speed
300MHz
Core Processor
TriCore™
Program Memory Type
Flash

Related Parts Comparison (TC356TA64F300SABKXUMA1 vs TC212L8F133NACKXUMA1 vs TC297TX128F300NBCKXUMA1 vs TC237LP32F200SABKXUMA1)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case180-LFBGA80-TQFP Exposed Pad292-LFBGA292-LFBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage3.3V, 5V3.3V3.3V, 5V3.3V
Core ProcessorTriCore™TriCore™TriCore™TriCore™
Core Size32-Bit Tri-Core32-Bit Single-Core32-Bit Tri-Core32-Bit Single-Core
RAM Size3.578K x 896K x 82.7M x 8192K x 8
Lifecycle StatusActiveActiveActiveActive
ConnectivityASC, CANbus, Ethernet, FlexRay, I²C, LINbus, QSPI, SENTCANbus, LINbus, QSPIASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENTCANbus, FlexRay, LINbus, QSPI
Oscillator TypeInternalExternalExternalExternal
PeripheralsDMA, I²S, LVDS, PWM, WDTDMA, WDTDMA, WDTDMA, WDT
Program Memory Size4MB (4M x 8)512KB (512K x 8)8MB (8M x 8)2MB (2M x 8)
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Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

Suggested replacements

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