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Infineon Technologies TC265D40F200WBBKXUMA2 Microcontroller, Microprocessor, FPGA Modules

IC MICROCONTROLLER

10,198 ActiveInfineon Technologies176-LQFP Exposed PadRoHS
TC265D40F200WBBKXUMA2 176-LQFP Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

TC265D40F200WBBKXUMA2
Part Number (MPN)
TC265D40F200WBBKXUMA2
Detailed Description
IC MICROCONTROLLER
Package
176-LQFP Exposed Pad
Key Features
Package / Case: 176-LQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF TC265D40F200WBBKXUMA2 Datasheet
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Technical Specifications

Infineon Technologies TC265D40F200WBBKXUMA2 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
240K x 8
Package / Case
176-LQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
1.17V ~ 5.5V
Lifecycle Status
Active
Peripherals
DMA, WDT
Number of I/O
112
Speed
200MHz
EEPROM Size
96K x 8

Related Parts Comparison (TC265D40F200WBBKXUMA2 vs TC375TP96F300WAAKXUMA1 vs TC365DP64F300WAAKXUMA1 vs TC275T64F200WDBKXUMA1)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case176-LQFP Exposed Pad176-LQFP Exposed Pad176-LQFP Exposed Pad176-LQFP Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage1.17V ~ 5.5V3.3V, 5V3.3V, 5V1.17V ~ 5.5V
Core ProcessorTriCore™TriCore™TriCore™TriCore™
Core Size32-Bit Dual-Core32-Bit Tri-Core32-Bit Dual-Core32-Bit Tri-Core
RAM Size240K x 81.1M x 8672K x 8472K x 8
Lifecycle StatusActiveActiveActiveActive
ConnectivityASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENTASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI, QSPI, SENTASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI, QSPI, SENTASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Oscillator TypeExternalInternalInternalExternal
PeripheralsDMA, WDTDMA, I²S, PWM, WDTDMA, I²S, PWM, WDTDMA, POR, WDT
Program Memory Size2.5MB (2.5M x 8)6MB (6M x 8)4MB (4M x 8)4MB (4M x 8)
Action

Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

Suggested replacements

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