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Infineon Technologies TC233L32F200FABKXUMA1 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 2MB FLASH 100TQFP

12,111 ActiveInfineon Technologies100-TQFP Exposed PadRoHS
TC233L32F200FABKXUMA1 - No Image Available

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TC233L32F200FABKXUMA1
Part Number (MPN)
TC233L32F200FABKXUMA1
Detailed Description
IC MCU 32BIT 2MB FLASH 100TQFP
Package
100-TQFP Exposed Pad
Key Features
Package / Case: 100-TQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF TC233L32F200FABKXUMA1 Datasheet
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Technical Specifications

Infineon Technologies TC233L32F200FABKXUMA1 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
192K x 8
Package / Case
100-TQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
3.3V
Peripherals
DMA, WDT
Number of I/O
78
Speed
200MHz
EEPROM Size
128K x 8
Core Processor
TriCore™

Alternate Parts Comparison (TC233L32F200FABKXUMA1 vs TC323LP16F160FAAKXUMA1 vs TC223L16F133FABKXUMA1 vs TC233LP32F200FACKXUMA1)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case100-TQFP Exposed Pad100-TQFP Exposed Pad100-TQFP Exposed Pad100-TQFP Exposed Pad
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)
Supply Voltage3.3V3.3V, 5V3.3V3.3V
Core ProcessorTriCore™TriCore™TriCore™TriCore™
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core
RAM Size192K x 8152K x 896K x 8192K x 8
ConnectivityCANbus, FlexRay, LINbus, QSPIASC, CANbus, FlexRay, LINbus, QSPICANbus, FlexRay, LINbus, QSPICANbus, FlexRay, LINbus, QSPI
Oscillator TypeExternalInternalExternalExternal
PeripheralsDMA, WDTDMA, I²S, PWM, WDTDMA, WDTDMA, WDT
Program Memory Size2MB (2M x 8)1MB (1M x 8)1MB (1M x 8)2MB (2M x 8)
Program Memory TypeFlashFlashFlashFlash
Action

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