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Infineon Technologies TC1724N192F80HRACKXUMA2 Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 1.5MB FLASH 144LQFP

1,814 ActiveInfineon Technologies144-LQFPRoHS
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TC1724N192F80HRACKXUMA2
Part Number (MPN)
TC1724N192F80HRACKXUMA2
Detailed Description
IC MCU 32BIT 1.5MB FLASH 144LQFP
Package
144-LQFP
Key Features
Package / Case: 144-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF TC1724N192F80HRACKXUMA2 Datasheet
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Technical Specifications

Infineon Technologies TC1724N192F80HRACKXUMA2 Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

RAM Size
152K x 8
Package / Case
144-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
1.17V ~ 3.63V
Lifecycle Status
Active
Peripherals
DMA, POR, WDT
Number of I/O
95
Speed
80MHz
EEPROM Size
64K x 8

Alternate Parts Comparison (TC1724N192F80HRACKXUMA2 vs TC1736128F80HLAAKXQMA1 vs TC234LP32F200FABKXUMA1 vs S6J336CHTBSC20000)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case144-LQFP144-LQFP144-LQFP144-LQFP
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 105°C (TA)
Supply Voltage1.17V ~ 3.63V1.42V ~ 1.58V3.3V2.7V ~ 5.5V
Core ProcessorTriCore™TriCore™TriCore™Arm® Cortex®-R5F
Core Size32-Bit Single-Core32-Bit Single-Core32-Bit Single-Core32-Bit
RAM Size152K x 848K x 8192K x 8128K x 8
ConnectivityASC, CANbus, MLI, MSC, SSCASC, CANbus, MLI, MSC, SSCCANbus, FlexRay, LINbus, QSPICANbus, CSIO, I²C, LINbus, UART/USART
Data ConvertersA/D 4x10b, 24x12bA/D 24x12bA/D 24x12bA/D 40x12b
Oscillator TypeExternalExternalExternalInternal
PeripheralsDMA, POR, WDTDMA, POR, WDTDMA, WDTDMA, I²S, LVD, POR, PWM, WDT
Program Memory Size1.5MB (1.5M x 8)1MB (1M x 8)2MB (2M x 8)112KB (112K x 8)
Program Memory TypeFlashFlashFlashFlash
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Cross Reference

Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .

Suggested replacements

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