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Infineon Technologies S6E1A11B0AGN2000G Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 56KB FLASH 32QFN

14,700 ActiveInfineon Technologies32-WFQFN Exposed PadRoHS
S6E1A11B0AGN2000G 32-WFQFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

S6E1A11B0AGN2000G
Part Number (MPN)
S6E1A11B0AGN2000G
Detailed Description
IC MCU 32BIT 56KB FLASH 32QFN
Package
32-WFQFN Exposed Pad
Key Features
Package / Case: 32-WFQFN Exposed Pad
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF S6E1A11B0AGN2000G Datasheet
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Technical Specifications

Infineon Technologies S6E1A11B0AGN2000G Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
FM0+ S6E1A1
RAM Size
6K x 8
RoHS
Yes
Package / Case
32-WFQFN Exposed Pad
Packaging
TRAY
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
DMA, LVD, POR, PWM, WDT
Speed
40MHz

Related Parts Comparison (S6E1A11B0AGN2000G vs BTS5012SDAAUMA1 vs XMC1302T038X0032ABXUMA1 vs CY8C6347BZI-BLD43)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case32-WFQFN Exposed PadTO-252-5, DPak38-TFSOP116-WFBGA
Operating Temperature-40°C ~ 105°C (TA)-40°C ~ 150°C (TJ)-40°C ~ 105°C (TA)-40°C ~ 85°C (TA)
Supply Voltage2.7V ~ 5.5VNot Required3.3 V1.7V ~ 3.6V
RoHSYesYesCompliantYes
Lifecycle StatusActiveActiveProductionActive
Halogen FreeNoYesHalogen FreeYes
Lead FreeYesYesLead FreeYes
PackagePG-VQFN-32PG-TO252-5TSSOP116-WFBGA
Core ProcessorARM® Cortex®-M0+--ARM® Cortex®-M0ARM® Cortex®-M4/M0
Core Size32-Bit--32-Bit Single-Core32-Bit Dual-Core
RAM Size6K x 8--16 kB288K x 8
Completely Lead FreeYesNo--Yes
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