Infineon Technologies S34MS01G200BHV003 Flash Memory
SLC NAND Flash Parallel 1.8V 1G-bit 128M x 8 63-Pin BGA Reel
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
S34MS01G200BHV003
Detailed Description
SLC NAND Flash Parallel 1.8V 1G-bit 128M x 8 63-Pin BGA Reel
Package
BGA
Key Features
Package: BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
Datasheet
S34MS01G200BHV003 Datasheet
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Technical Specifications
Infineon Technologies S34MS01G200BHV003 Flash Memory technical specifications.
General
Number of Pins
63
Mounting Type
Surface Mount
Ppap
No
Package Length
11
Package
BGA
Automotive
No
Supplier Package
BGA
Lead Shape
Ball
Package Height
1(Max) - 0.25(Min)
Package Width
9
Alternate Parts Comparison (S34MS01G200BHV003 vs S34ML01G100BHI000 vs S29GL064A90FFIR20 vs S29GL512T11DHV013)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Number of Pins | 63 | -- | -- | 64 |
| Automotive | No | -- | -- | No |
| Package | BGA | -- | -- | BGA |
| Package Height | 1(Max) - 0.25(Min) | -- | -- | 0.6(Min) |
| Package Length | 11 | -- | -- | 9 |
| Package Width | 9 | -- | -- | 9 |
| Ppap | No | -- | -- | No |
| Supplier Package | BGA | -- | -- | Fortified BGA |
| Lead Shape | Ball | -- | -- | -- |
| Package / Case | -- | BGA | BGA | 64-LBGA |
| Operating Temperature | -- | -40°C ~ 85°C (TA) | -40°C ~ 85°C | -40°C ~ 105°C (TA) |
| Action |
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