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Infineon Technologies IGCM10F60GAXKMA1 Microcontrollers

IGBT 600V 24MDIP

564 ActiveInfineon Technologies24-PowerDIP Module (1.028", 26.10mm)$11.37
IGCM10F60GAXKMA1 24-PowerDIP Module (1.028", 26.10mm) package illustration

Same model may have multiple batches, images only for reference.

IGCM10F60GAXKMA1
Part Number (MPN)
IGCM10F60GAXKMA1
Detailed Description
IGBT 600V 24MDIP
Package
24-PowerDIP Module (1.028", 26.10mm)
Lifecycle Status
Active
Datasheet
PDF IGCM10F60GAXKMA1 Datasheet
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Technical Specifications

Infineon Technologies IGCM10F60GAXKMA1 Microcontrollers technical specifications.

General

Series
CIPOS™
RoHS
Compliant
Number of Pins
24
Package / Case
24-PowerDIP Module
Packaging
Tube
Mounting Type
Through Hole
Operating Temperature
-40 °C ~ 150 °C
Supply Voltage
14 V ~ 18.5 V
Lifecycle Status
Active
Automotive
No

Alternate Parts Comparison (IGCM10F60GAXKMA1 vs XMC1302T038X0032ABXUMA1 vs MB90F543GSPF-GS-9017 vs TC222L16F133NACKXUMA1)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case24-PowerDIP Module38-TFSOP100-BQFP80-TQFP Exposed Pad
Operating Temperature-40 °C ~ 150 °C-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 125°C (TA)
Supply Voltage14 V ~ 18.5 V3.3 V4.5V ~ 5.5V3.3V
Lifecycle StatusActiveProductionObsoleteActive
SeriesCIPOS™--F²MC-16LX MB90540GAURIX™
Mounting TypeThrough HoleSurface MountSurface Mount--
RoHSCompliantCompliantYes--
Core Processor--ARM® Cortex®-M0F²MC-16LXTriCore™
Core Size--32-Bit Single-Core16-Bit32-Bit Single-Core
RAM Size--16 kB6K x 896K x 8
Connectivity--I²C, LINbus, SPI, UART/USARTCANbus, EBI/EMI, SCI, Serial I/O, UART/USARTCANbus, FlexRay, LINbus, QSPI
Data Converters--A/D 16x12bA/D 8x8/10bA/D 24x12b SAR
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