Infineon Technologies CYT4DNJBRCQ1BZSGST Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 6.188MB FLSH 327BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
CYT4DNJBRCQ1BZSGST
Detailed Description
IC MCU 32BIT 6.188MB FLSH 327BGA
Package
327-BGA
Key Features
Package / Case: 327-BGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
CYT4DNJBRCQ1BZSGST Datasheet
Quick Jump:
Technical Specifications
Infineon Technologies CYT4DNJBRCQ1BZSGST Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
Traveo™ T2G
RAM Size
640K x 8
RoHS
Yes
Package / Case
327-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Peripherals
DMA, I²S, LVD, Temp Sensor, WDT
Number of I/O
168
Alternate Parts Comparison (CYT4DNJBRCQ1BZSGST vs CYT4DNJBRCQ1BZSGS vs CYT2B95CACQ0AZEGS vs CYT2B95BACQ0AZSGS)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Series | Traveo™ T2G | Traveo™ T2G | Traveo CYT2B9 | Traveo™ T2G |
| Package / Case | 327-BGA | 327-BGA | 100-LQFP | 100-LQFP |
| Operating Temperature | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 105°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Core Processor | ARM® Cortex®-M0+, ARM® Cortex®-M7F | ARM® Cortex®-M0+, ARM® Cortex®-M7F | ARM® Cortex®-M0+/M4F | ARM® Cortex®-M0+, ARM® Cortex®-M4F |
| Core Size | 32-Bit Quad-Core | 32-Bit Quad-Core | 32-Bit Dual-Core | 32-Bit Dual-Core |
| RAM Size | 640K x 8 | 640K x 8 | 256K x 8 | 256K x 8 |
| Connectivity | CANbus, Ethernet, LINbus, SPI | CANbus, Ethernet, LINbus, SPI | CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART | CANbus, FIFO, I²C, IrDA, LINbus, SPI, UART/USART |
| EEPROM Size | 128K x 8 | 128K x 8 | 128K x 8 | 128K x 8 |
| Peripherals | DMA, I²S, LVD, Temp Sensor, WDT | DMA, I²S, LVD, Temp Sensor, WDT | Brown-out Detect/Reset, DMA, POR, PWM, WDT | Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT |
| Program Memory Size | 6.188MB (6.188M x 8) | 6.188MB (6.188M x 8) | 2.0625MB (2.0625M x 8) | 2.0625MB (2.0625M x 8) |
| Program Memory Type | Flash | Flash | Flash | Flash |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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