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Infineon Technologies CYPDC1186B2-30FNXIT Microcontroller, Microprocessor, FPGA Modules

TYPE-C - OTHERS

1,814 ActiveInfineon Technologies30-UFBGA, WLCSPRoHS
CYPDC1186B2-30FNXIT 30-UFBGA, WLCSP package illustration

Same model may have multiple batches, images only for reference.

CYPDC1186B2-30FNXIT
Part Number (MPN)
CYPDC1186B2-30FNXIT
Detailed Description
TYPE-C - OTHERS
Package
30-UFBGA, WLCSP
Key Features
Package / Case: 30-UFBGA, WLCSP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF CYPDC1186B2-30FNXIT Datasheet
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Technical Specifications

Infineon Technologies CYPDC1186B2-30FNXIT Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
EZ-PD™ CCG3
Interface
I²C, SPI, UART/USART, USB
RAM Size
8K x 8
RoHS
Yes
Package / Case
30-UFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Active
Application
USB Type C

Related Parts Comparison (CYPDC1186B2-30FNXIT vs CYPDC1185B2-32LQXQ vs CYPDC1185B2-32LQXQT vs BTS5012SDAAUMA1)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case30-UFBGA32-UFQFN Exposed Pad32-UFQFN Exposed PadTO-252-5, DPak
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 105°C (TA)-40°C ~ 105°C (TA)-40°C ~ 150°C (TJ)
Supply Voltage2.7V ~ 5.5V2.7V ~ 5.5V2.7V ~ 5.5VNot Required
InterfaceI²C, SPI, UART/USART, USBI²C, SPI, UART/USART, USBI²C, SPI, UART/USART, USBOn/Off
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
PackageUFBGA-30PG-VQFN-32QFN EP-32PG-TO252-5
SeriesEZ-PD™ CCG3EZ-PD™ CCG3EZ-PD™ CCG3--
Mounting TypeSurface Mount--Surface MountSurface Mount
Core ProcessorARM® Cortex®-M0ARM® Cortex®-M0ARM® Cortex®-M0--
RAM Size8K x 88K x 88K x 8--
ApplicationUSB Type CUSB Type CUSB Type C--
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