Infineon Technologies CY91F59BCPB-GSE1KR Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 2.056MB FLSH 320BGA

Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
CY91F59BCPB-GSE1KR
Detailed Description
IC MCU 32BIT 2.056MB FLSH 320BGA
Package
320-BBGA
Key Features
Package / Case: 320-BBGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
CY91F59BCPB-GSE1KR Datasheet
Quick Jump:
Technical Specifications
Infineon Technologies CY91F59BCPB-GSE1KR Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
FR MB91590
RAM Size
2.007M x 8
Package / Case
320-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
2.7V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
DMA, LVD, POR, PWM, WDT
Number of I/O
63
Speed
80MHz
Alternate Parts Comparison (CY91F59BCPB-GSE1KR vs CY7C1360C-200AXCT vs CY7C1361C-133AXI vs CY7C25632KV18-550BZC)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Series | FR MB91590 | CY7C1360C | CY7C1361C | CY7C25632KV18 |
| Package / Case | 320-BBGA | 100-LQFP | 100-LQFP | 165-LBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) |
| Supply Voltage | 2.7V ~ 5.5V | 3.135V ~ 3.6V | 3.135V ~ 3.6V | 1.7V ~ 1.9V |
| Base Product Number | -- | -- | -- | -- |
| Memory Size | -- | 9M | 9M | 72M |
| Interface | -- | Parallel | Parallel | Parallel |
| Maximum Clock Frequency | -- | 200 MHz | 133 MHz | 550 MHz |
| Number of Pins | -- | 100 | 100 | 165 |
| Lifecycle Status | Obsolete | Active | Active | Active |
| Access Time | -- | 3 ns | 6.5 ns | 450 ps |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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