Infineon Technologies CY91F467EAPMC-GS-UJE2 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BT 1.0625MB FLSH 208QFP
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
CY91F467EAPMC-GS-UJE2
Detailed Description
IC MCU 32BT 1.0625MB FLSH 208QFP
Package
208-LQFP
Key Features
Package / Case: 208-LQFP; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
CY91F467EAPMC-GS-UJE2 Datasheet
Quick Jump:
Technical Specifications
Infineon Technologies CY91F467EAPMC-GS-UJE2 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
FR CY91460E
RAM Size
112K x 8
RoHS
Yes
Package / Case
208-LQFP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C (TA)
Supply Voltage
3V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
DMA, LVD, PWM, WDT
Number of I/O
170
Alternate Parts Comparison (CY91F467EAPMC-GS-UJE2 vs CY7C1360C-200AXCT vs CY7C1361C-133AXI vs CY7C25632KV18-550BZC)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Series | FR CY91460E | CY7C1360C | CY7C1361C | CY7C25632KV18 |
| Package / Case | 208-LQFP | 100-LQFP | 100-LQFP | 165-LBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) |
| Supply Voltage | 3V ~ 5.5V | 3.135V ~ 3.6V | 3.135V ~ 3.6V | 1.7V ~ 1.9V |
| RoHS | Yes | Compliant | Compliant | Not Compliant |
| Lifecycle Status | Obsolete | Active | Active | Active |
| Package | 208-LQFP | QFP | QFP | BGA |
| Memory Size | -- | 9M | 9M | 72M |
| Interface | -- | Parallel | Parallel | Parallel |
| Maximum Clock Frequency | -- | 200 MHz | 133 MHz | 550 MHz |
| Number of Pins | -- | 100 | 100 | 165 |
| Action |
Cross Reference
Manufacturer-stated alternates from official cross-reference tools. These are not a guaranteed pin-compatible drop-in. Qualify package, pinout, and electrical limits against the datasheet before a board change. See cross-reference vs drop-in compatible .
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