Infineon Technologies CY62177G30-55BKXI Memory Integrated Circuit
IC SRAM 32MBIT PARALLEL 48FBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
CY62177G30-55BKXI
Detailed Description
IC SRAM 32MBIT PARALLEL 48FBGA
Package
48-TFBGA
Key Features
Package / Case: 48-TFBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
CY62177G30-55BKXI Datasheet
Quick Jump:
Technical Specifications
Infineon Technologies CY62177G30-55BKXI Memory Integrated Circuit technical specifications.
General
Series
MoBL®
Memory Size
32 Mbit
RoHS
Compliant
Number of Pins
48
Package / Case
48-TFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.2V ~ 3.6V
Lifecycle Status
LTB
Technology
SRAM - Asynchronous
Alternate Parts Comparison (CY62177G30-55BKXI vs CY7C1360C-200AXCT vs CY7C1361C-133AXI vs CY7C25632KV18-550BZC)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Series | MoBL® | CY7C1360C | CY7C1361C | CY7C25632KV18 |
| Package / Case | 48-TFBGA | 100-LQFP | 100-LQFP | 165-LBGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) |
| Supply Voltage | 2.2V ~ 3.6V | 3.135V ~ 3.6V | 3.135V ~ 3.6V | 1.7V ~ 1.9V |
| Memory Size | 32 Mbit | 9M | 9M | 72M |
| Number of Pins | 48 | 100 | 100 | 165 |
| RoHS | Compliant | Compliant | Compliant | Not Compliant |
| Lifecycle Status | LTB | Active | Active | Active |
| Access Time | 55 ns | 3 ns | 6.5 ns | 450 ps |
| Memory Format | SRAM | SRAM | SRAM | SRAM |
| Memory Interface | Parallel | Parallel | Parallel | Parallel |
| Action |
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