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Infineon Technologies CY62167G30-55ZXE SRAM

SRAM Memory IC 16M Parallel 2.2V ~ 3.6V 48-TSOP I

In Stock ActiveInfineon TechnologiesTSOP-IRoHS
CY62167G30-55ZXE TSOP-I package illustration

Same model may have multiple batches, images only for reference.

CY62167G30-55ZXE
Part Number (MPN)
CY62167G30-55ZXE
Detailed Description
IC SRAM 16MBIT PARALLEL 48TSOP I
Package
TSOP-I
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF CY62167G30-55ZXE Datasheet
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Technical Specifications

Infineon Technologies CY62167G30-55ZXE SRAM technical specifications.

General

Series
MoBL®
Interface
Parallel
Memory Size
16M
RoHS
Compliant
Number of Pins
48
Package / Case
48-TFSOP
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 125°C (TA)
Supply Voltage
2.2V ~ 3.6V
Lifecycle Status
Active

Related Parts Comparison (CY62167G30-55ZXE vs CY7S1061G30-10ZXIT vs CY7C1473BV33-133AXC vs CY7C1360C-200AXCT)

Side-by-side specifications of related catalog parts.

Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.

This PartRelated PartRelated PartRelated Part
Package / Case48-TFSOP48-TFSOP100-LQFP100-LQFP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)0°C ~ 70°C (TA)0°C ~ 70°C (TA)
Supply Voltage2.2V ~ 3.6V2.2V ~ 3.6V3.135V ~ 3.6V3.135V ~ 3.6V
Memory Size16M16M72M9M
Number of Pins4848100100
RoHSCompliantCompliantCompliantCompliant
Lifecycle StatusActiveActiveActiveActive
Access Time55 ns10 ns6.5 ns3 ns
Address Bus Width Bit20202218
AutomotiveYesNoNoNo
Data Rate ArchitectureSDRSDRSDRSDR
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