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Infineon Technologies BGB707L7ESDE6327XTSA1 Microcontrollers

IC RF AMP 802.11A/B/G/N TSLP7-1

516 ActiveInfineon Technologies6-XFDFN Exposed Pad$0.76
BGB707L7ESDE6327XTSA1 6-XFDFN Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

BGB707L7ESDE6327XTSA1
Part Number (MPN)
BGB707L7ESDE6327XTSA1
Detailed Description
IC RF AMP 802.11A/B/G/N TSLP7-1
Package
6-XFDFN Exposed Pad
Lifecycle Status
Active
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Technical Specifications

Infineon Technologies BGB707L7ESDE6327XTSA1 Microcontrollers technical specifications.

General

RoHS
Compliant
Number of Pins
6
Number of Channels
1
Package / Case
6-XFDFN Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
- 55°C ~ 150 °C
Supply Voltage
1.8 V ~ 4 V
Lifecycle Status
Active
Automotive
Yes
Current Supply
25 mA

Alternate Parts Comparison (BGB707L7ESDE6327XTSA1 vs BGB-540-E6327 vs XMC1302T038X0032ABXUMA1 vs MB90F543GSPF-GS-9017)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case6-XFDFN Exposed Pad--38-TFSOP100-BQFP
Mounting TypeSurface Mount--Surface MountSurface Mount
Operating Temperature- 55°C ~ 150 °C---40°C ~ 105°C (TA)-40°C ~ 105°C (TA)
Supply Voltage1.8 V ~ 4 V--3.3 V4.5V ~ 5.5V
RoHSCompliant--CompliantYes
Lifecycle StatusActive--ProductionObsolete
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