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Bourns SF-0603SP315-2 Microcontrollers

Fuse Chip Slow Blow Acting 3.15A 32V SMD Solder Pad 0603 Ceramic T/R

2,501 ActiveBourns0603 (1608Metric)$0.82
SF-0603SP315-2 0603 (1608Metric) package illustration

Same model may have multiple batches, images only for reference.

SF-0603SP315-2
Manufacturer
Part Number (MPN)
SF-0603SP315-2
Detailed Description
Fuse Chip Slow Blow Acting 3.15A 32V SMD Solder Pad 0603 Ceramic T/R
Package
0603 (1608Metric)
Lifecycle Status
Active
Datasheet
PDF SF-0603SP315-2 Datasheet
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Technical Specifications

Bourns SF-0603SP315-2 Microcontrollers technical specifications.

General

Series
SF-0603SP
RoHS
Yes
Operating Temperature
- 20°C ~ + 105°C
Fuse Type
Time Delay / Slow Blow
Current Rating
3.15 A
Voltage Rating Dc
32 VDC
Interrupt Rating
50 A at 32 VDC
Fuse Size Group
0603 (1608 metric)
Resistance
16 mOhms
Trade Name
SinglFuse

Alternate Parts Comparison (SF-0603SP315-2 vs SF-0603SP100-2 vs SF-0603F063-2 vs SF-0603F080-2)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesSF-0603SPSF-0603SPSF-0603FSF-0603F
Operating Temperature- 20°C ~ + 105°C- 20°C ~ + 105°C- 20°C ~ + 120°C- 20°C ~ + 120°C
Resistance16 mOhms83 mOhms173 mOhms115 mOhms
RoHSYesYesYesYes
Current Rating3.15 A1 A630 mA800 mA
Fuse Size Group0603 (1608 metric)0603 (1608 metric)0603 (1608 metric)0603 (1608 metric)
Fuse TypeTime Delay / Slow BlowTime Delay / Slow BlowFast BlowFast Blow
Interrupt Rating50 A at 32 VDC50 A at 32 VDC50 A50 A at 32 VDC
Package0603 (1608Metric)0603 (1608Metric)0603 (1608Metric)0603 (1608Metric)
Trade NameSinglFuseSinglFuseSinglFuseSinglFuse
TypeTime Lag Surface Mount FusesTime Lag Surface Mount FusesFast Acting Thin Film Chip Surface Mount FuseFast Acting Thin Film Chip Surface Mount Fuse
Unit Weight0.000045 oz0.000045 oz0.000046 oz0.000046 oz
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