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Analog Devices MAXQ3210-EMX+ Microcontroller, Microprocessor, FPGA Modules

IC MCU 16BIT 2KB EEPROM 24DIP

1,832Analog Devices24-DIP (0.300", 7.62mm)RoHS
MAXQ3210-EMX+ 24-DIP (0.300", 7.62mm) package illustration

Same model may have multiple batches, images only for reference.

MAXQ3210-EMX+
Manufacturer
Part Number (MPN)
MAXQ3210-EMX+
Detailed Description
IC MCU 16BIT 2KB EEPROM 24DIP
Package
24-DIP (0.300", 7.62mm)
Key Features
Package / Case: 24-DIP (0.300", 7.62mm); Mounting Type: Through Hole
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
PDF MAXQ3210-EMX+ Datasheet
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Technical Specifications

Analog Devices MAXQ3210-EMX+ Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
MAXQ®
RAM Size
64 x 8
RoHS
Yes
Package / Case
24-DIP
Mounting Type
Through Hole
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
4.5V ~ 5.5V
Lifecycle Status
Obsolete
Peripherals
LED, Power-Fail Reset, POR, PWM, WDT
Number of I/O
15

Alternate Parts Comparison (MAXQ3210-EMX+ vs MAXQ2010-RFX+ vs MAXQ7667AACM/V+ vs MAXQ622G-0000+)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case24-DIP100-LQFP48-LQFP64-LQFP
Mounting TypeThrough HoleSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)-40°C ~ 125°C (TA)0°C ~ 70°C (TA)
Supply Voltage4.5V ~ 5.5V2.7V ~ 3.6V2.25V ~ 2.75V1.7V ~ 3.6V
Core Size16-Bit16-Bit16-Bit16-Bit
RAM Size64 x 82K x 82K x 166K x 8
RoHSYesYesYesYes
Lifecycle StatusObsoleteObsoleteNot For New DesignsActive
Number of I/O15551644
Oscillator TypeInternalInternalInternalInternal
Package24-DIP (0.300", 7.62mm)100-LQFP48-LQFP64-LQFP
PeripheralsLED, Power-Fail Reset, POR, PWM, WDTBrown-out Detect/Reset, LCD, POR, PWM, WDTBrown-out Detect/Reset, POR, WDTBrown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
Action

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