Analog Devices MAX5550ETE+ Digital to Analog Converters (DAC)
30us 2.7V~5.25V 10Bit QFN-16-EP(3x3) Digital To Analog Converters (DACs)
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MAX5550ETE+
Base Model
Detailed Description
30us 2.7V~5.25V 10Bit QFN-16-EP(3x3) Digital To Analog Converters (DACs)
Package
16-WFQFN Exposed Pad
Key Features
Package: 16-WFQFN Exposed Pad
Lifecycle Status
Active
Datasheet
MAX5550ETE+ Datasheet
Quick Jump:
Technical Specifications
Analog Devices MAX5550ETE+ Digital to Analog Converters (DAC) technical specifications.
General
Series
MAX5550
RoHS
Yes
Number of Channels
2 Channel
Package / Case
16-WFQFN Exposed Pad
Mounting Type
SMD/SMT
Operating Temperature
-40°C ~ 85°C
Supply Voltage
3 V
Lifecycle Status
Active
Package
16-WFQFN Exposed Pad
Architecture
Current Steering
Alternate Parts Comparison (MAX5550ETE+ vs MAX5550ETE+T vs LTC2635CUD-HZ8#TRPBF vs LTC2635HUD-LMO8#PBF)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 16-WFQFN Exposed Pad | 16-WFQFN Exposed Pad | 16-WFQFN Exposed Pad | 16-WFQFN Exposed Pad |
| Mounting Type | SMD/SMT | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | 0°C ~ 70°C | -40°C ~ 125°C |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Data Interface | I²C, SPI | I²C, SPI | I²C | I²C |
| Differential Output | No | No | No | No |
| Inldnl Lsb | ±2, ±1 (Max) | ±2, ±1 (Max) | ±0.05, ±0.5 (Max) | ±0.05, ±0.5 (Max) |
| Number of Bits | 10 | 10 | 8 | 8 |
| Number of Da Converters | 2 | 2 | 4 | 4 |
| Output Type | Current - Buffered | Current - Buffered | Voltage - Buffered | Voltage - Buffered |
| Package | 16-WFQFN Exposed Pad | 16-WFQFN Exposed Pad | QFN-16 | 16-WFQFN |
| Action |
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