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Analog Devices MAX32620ICQ+W Microcontroller, Microprocessor, FPGA Modules

IC MCU 32BIT 2MB FLASH 100TQFP

11,124 ActiveAnalog Devices100-TQFP Exposed PadRoHS
MAX32620ICQ+W 100-TQFP Exposed Pad package illustration

Same model may have multiple batches, images only for reference.

MAX32620ICQ+W
Manufacturer
Part Number (MPN)
MAX32620ICQ+W
Detailed Description
IC MCU 32BIT 2MB FLASH 100TQFP
Package
100-TQFP Exposed Pad
Key Features
Package / Case: 100-TQFP Exposed Pad; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MAX32620ICQ+W Datasheet
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Technical Specifications

Analog Devices MAX32620ICQ+W Microcontroller, Microprocessor, FPGA Modules technical specifications.

General

Series
DARWIN
RAM Size
256K x 8
RoHS
Yes
Package / Case
100-TQFP Exposed Pad
Mounting Type
Surface Mount
Operating Temperature
-30°C ~ 85°C (TA)
Supply Voltage
1.14V ~ 3.6V
Lifecycle Status
Active
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
49

Alternate Parts Comparison (MAX32620ICQ+W vs MAX4053ACSE+ vs MAX4649EKA+T vs MAX3160EEAP+)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case100-TQFP Exposed Pad16-SOICSOT-23-820-SSOP
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-30°C ~ 85°C (TA)0°C ~ 70°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C
Supply Voltage1.14V ~ 3.6V8 V20 V3V ~ 5.5V
RoHSYesCompliantCompliantCompliant
Lifecycle StatusActiveProductionProductionProduction
Package100-TQFPExposedPadSOICSOT-23-8SSOP
Number of Pins--16820
Number of Channels--312
Height--1.5 mm1.3 mm1.99 mm
Lead Free--Contains Lead, Lead FreeLead FreeLead Free
Length--10 mm3 mm7.33 mm
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