Analog Devices MAX32560-LBJ+ Microcontroller, Microprocessor, FPGA Modules
DEEPCOVER SECURE ARM CORTEX-M3 F
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
MAX32560-LBJ+
Detailed Description
DEEPCOVER SECURE ARM CORTEX-M3 F
Package
144-TFBGA
Key Features
Package / Case: 144-TFBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
MAX32560-LBJ+ Datasheet
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Technical Specifications
Analog Devices MAX32560-LBJ+ Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
Series
DeepCover®
RAM Size
384K x 8
RoHS
Yes
Number of Pins
144
Package / Case
144-TFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
3.3V
Lifecycle Status
Active
Peripherals
Crypto - AES, DMA, LCD, PWM, RSA, SHA, TRNG, WDT
Alternate Parts Comparison (MAX32560-LBJ+ vs MAX4053ACSE+ vs MAX4649EKA+T vs MAX3160EEAP+)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 144-TFBGA | 16-SOIC | SOT-23-8 | 20-SSOP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C |
| Supply Voltage | 3.3V | 8 V | 20 V | 3V ~ 5.5V |
| Number of Pins | 144 | 16 | 8 | 20 |
| RoHS | Yes | Compliant | Compliant | Compliant |
| Lifecycle Status | Active | Production | Production | Production |
| Package | TFBGA-144 | SOIC | SOT-23-8 | SSOP |
| Number of Channels | -- | 3 | 1 | 2 |
| Height | -- | 1.5 mm | 1.3 mm | 1.99 mm |
| Lead Free | -- | Contains Lead, Lead Free | Lead Free | Lead Free |
| Length | -- | 10 mm | 3 mm | 7.33 mm |
| Action |
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