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Analog Devices MAX2982C/DW Telecom

14MBPS DIGITAL PLC MODEM (WAFER)

10 ActiveAnalog DevicesDieRoHS
MAX2982C/DW Die package illustration

Same model may have multiple batches, images only for reference.

MAX2982C/DW
Manufacturer
Part Number (MPN)
MAX2982C/DW
Detailed Description
14MBPS DIGITAL PLC MODEM (WAFER)
Package
Die
Key Features
Package / Case: Die; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF MAX2982C/DW Datasheet
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Technical Specifications

Analog Devices MAX2982C/DW Telecom technical specifications.

General

Series
Automotive, AEC-Q100
Interface
MII, RMII
RoHS
Yes
Package / Case
Die
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 105°C
Supply Voltage
1.14V ~ 1.32V, 3V ~ 1.26V
Lifecycle Status
Active
Current Supply
365mA
Number of Circuits
1

Alternate Parts Comparison (MAX2982C/DW vs MAX1383ATP+T vs MAX9026EBT+T vs MAX20410AFOB/VY+)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
SeriesAutomotive, AEC-Q100MAX1383Beyond-the-Rails™Automotive, AEC-Q100
Package / CaseDie20-WQFN Exposed Pad6-WFBGA, WLBGA17-PowerWFQFN
Mounting TypeSurface MountSurface MountSurface MountSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 105°C-40°C ~ 125°C-40°C ~ 85°C-40°C ~ 125°C (TA)
RoHSYesYesYesYes
Lifecycle StatusActiveActiveActiveActive
PackageDie20-WQFN Exposed Pad6-WFBGA, WLBGAF173A3FY+4
Supply Voltage1.14V ~ 1.32V, 3V ~ 1.26V4.75 V ~ 5.25 V1.8 V ~ 5.5 V--
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