Analog Devices FIDO1100BGB208IR1 Microcontroller, Microprocessor, FPGA Modules
IC MCU 32BIT 32KB RREM 208BGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
FIDO1100BGB208IR1
Detailed Description
IC MCU 32BIT 32KB RREM 208BGA
Package
208-TFBGA
Key Features
Package / Case: 208-TFBGA; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
FIDO1100BGB208IR1 Datasheet
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Technical Specifications
Analog Devices FIDO1100BGB208IR1 Microcontroller, Microprocessor, FPGA Modules technical specifications.
General
RAM Size
24K x 8
Package / Case
208-TFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C (TA)
Supply Voltage
2.25V ~ 3.6V
Peripherals
DMA, POR, WDT
Number of I/O
72
Speed
66MHz
Core Processor
CPU32
Program Memory Type
RREM
Alternate Parts Comparison (FIDO1100BGB208IR1 vs FIDO5210BBCZ vs FIDO5210BBCZ-R7 vs FIDO5110CBCZ)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 208-TFBGA | 144-LFBGA, CSPBGA | 144-LFBGA, CSPBGA | 144-LFBGA, CSPBGA |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 105°C |
| Supply Voltage | 2.25V ~ 3.6V | 1.08V ~ 1.32V, 2.97V ~ 3.63V | 1.08V ~ 1.32V, 2.97V ~ 3.63V | 1.08V ~ 1.32V, 2.97V ~ 3.63V |
| Interface | -- | MII, RMII | MII, RMII | MII, RMII |
| Protocol | -- | Ethernet | Ethernet | Ethernet |
| Current Supply | -- | 48mA | 48mA | 48mA |
| Function | -- | Switch | Switch | Switch |
| Standards | -- | IEEE 802.3, 10/100 Base-T/TX PHY | IEEE 802.3, 10/100 Base-T/TX PHY | IEEE 802.3, 10/100 Base-T/TX PHY |
| Action |
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