Analog Devices DS34T108GN+ Integrated Circuits (ICs)
IC TDM 484HSBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DS34T108GN+
Detailed Description
IC TDM 484HSBGA
Package
484-BGA Exposed Pad
Key Features
Package: 484-BGA Exposed Pad
Lifecycle Status
Not For New Designs
Datasheet
DS34T108GN+ Datasheet
Quick Jump:
Technical Specifications
Analog Devices DS34T108GN+ Integrated Circuits (ICs) technical specifications.
General
RoHS
Yes
Package / Case
484-BGA Exposed Pad
Mounting Type
Surface Mount
Lifecycle Status
Not For New Designs
Package
484-BGA Exposed Pad
Type
TDM (Time Division Multiplexing)
Applications
Data Transport
Alternate Parts Comparison (DS34T108GN+ vs DS1230Y-120+ vs DS1220AB-200IND+ vs DS1225AB-70+)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 484-BGA Exposed Pad | 28-DIP Module | 24-DIP Module | 28-DIP Module |
| Mounting Type | Surface Mount | Through Hole | Through Hole | Through Hole |
| RoHS | Yes | Compliant | Compliant | Compliant |
| Lifecycle Status | Not For New Designs | Active | Active | Active |
| Package | 484-BGA Exposed Pad | DIP | DIP | DIP |
| Series | -- | DS1230Y | DS1220AB | DS1225AB |
| Operating Temperature | -- | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) |
| Supply Voltage | -- | 4.5V ~ 5.5V | 4.75V ~ 5.25V | 4.75V ~ 5.25V |
| Memory Size | -- | 256Kb (32K x 8) | 16Kbit | 64Kbit |
| Interface | -- | Parallel | Parallel | Parallel |
| Data Bus Width | -- | 8 | 8 | 8 |
| Number of Pins | -- | 28 | 24 | 28 |
| Action |
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