Analog Devices DS34S132GN Telecom
IC TELECOM INTERFACE 676TEPBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
DS34S132GN
Detailed Description
IC TELECOM INTERFACE 676TEPBGA
Package
676-BGA
Key Features
Package / Case: 676-BGA; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
DS34S132GN Datasheet
Quick Jump:
Technical Specifications
Analog Devices DS34S132GN Telecom technical specifications.
General
Interface
TDMoP
RoHS
Yes
Package / Case
676-BGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Supply Voltage
1.8V, 3.3V
Lifecycle Status
Obsolete
Number of Circuits
1
Function
TDM-over-Packet (TDMoP)
Package
676-BGA
Alternate Parts Comparison (DS34S132GN vs DS1230Y-120+ vs DS1220AB-200IND+ vs DS1225AB-70+)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 676-BGA | 28-DIP Module | 24-DIP Module | 28-DIP Module |
| Mounting Type | Surface Mount | Through Hole | Through Hole | Through Hole |
| Operating Temperature | -40°C ~ 85°C | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | 0°C ~ 70°C (TA) |
| Supply Voltage | 1.8V, 3.3V | 4.5V ~ 5.5V | 4.75V ~ 5.25V | 4.75V ~ 5.25V |
| Interface | TDMoP | Parallel | Parallel | Parallel |
| RoHS | Yes | Compliant | Compliant | Compliant |
| Lifecycle Status | Obsolete | Active | Active | Active |
| Package | 676-BGA | DIP | DIP | DIP |
| Series | -- | DS1230Y | DS1220AB | DS1225AB |
| Memory Size | -- | 256Kb (32K x 8) | 16Kbit | 64Kbit |
| Data Bus Width | -- | 8 | 8 | 8 |
| Number of Pins | -- | 28 | 24 | 28 |
| Action |
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