Analog Devices ADAU1860BCBZRL CODECs
56-BUMP WAFER LEVEL CHIP SCALE P
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
ADAU1860BCBZRL
Detailed Description
56-BUMP WAFER LEVEL CHIP SCALE P
Package
56-UFBGA, WLCSP
Key Features
Package / Case: 56-UFBGA, WLCSP; Mounting Type: Surface Mount
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
ADAU1860BCBZRL Datasheet
Quick Jump:
Technical Specifications
Analog Devices ADAU1860BCBZRL CODECs technical specifications.
General
RoHS
Yes
Package / Case
56-UFBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 85°C
Lifecycle Status
Active
Type
Audio
Resolution Bits
24 b
Data Interface
I²C, I²S, SPI
Voltage Supply Analog
1.7V ~ 1.98V
Voltage Supply Digital
0.85V ~ 1.21V
Alternate Parts Comparison (ADAU1860BCBZRL vs ADAU1966AWBSTZ-RL vs ADAU1962AWBSTZ-RL vs ADAU1961WBCPZ-RL)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Package / Case | 56-UFBGA | 80-LQFP | 80-LQFP | 32-VFQFN Exposed Pad, CSP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 105°C | -40°C ~ 125°C | -40°C ~ 105°C |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Data Interface | I²C, I²S, SPI | I²C, SPI | I²C, SPI | I²C, Serial, SPI™ |
| Package | WLCSP-56 | LQFP-80 | LQFP-80 | 32-VFQFN Exposed Pad, CSP |
| Voltage Supply Analog | 1.7V ~ 1.98V | 3.14V ~ 3.46V | 3.14V ~ 3.46V | 2.97V ~ 3.63V |
| Voltage Supply Digital | 0.85V ~ 1.21V | 2.25V ~ 3.46V | 2.25V ~ 3.46V | 2.97V ~ 3.63V |
| Grade | -- | Automotive | Automotive | Automotive |
| Number of Adcs Dacs | -- | 16 | 12 | 2 / 2 |
| Action |
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