Analog Devices AD9867-WAFER Specialized ICs
Broadband Front-End Wafer
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
AD9867-WAFER
Category
Detailed Description
IC BROADBAND FRONT-END WAFER
Package
Die
Key Features
Package / Case: Die; Mounting Type: Surface Mount
Lifecycle Status
Obsolete
RoHS State
RoHS Compliant
Datasheet
AD9867-WAFER Datasheet
Quick Jump:
Technical Specifications
Analog Devices AD9867-WAFER Specialized ICs technical specifications.
General
Series
MxFE™
RoHS
Yes
Package / Case
Die
Mounting Type
Surface Mount
Lifecycle Status
Obsolete
Type
Broadband Front-End
Applications
Power Line Networking
Programmable
Not Verified
Package
Die
Alternate Parts Comparison (AD9867-WAFER vs AD8065ARZ-REEL7 vs AD8602ARMZ-REEL vs AD5621BKSZ-REEL7)
Side-by-side technical parameter comparison of related primary models in this product family.
| This Part | Alternate Parts | Alternate Parts | Alternate Parts | |
|---|---|---|---|---|
| Series | MxFE™ | FastFET™ | DigiTrim® | nanoDAC® |
| Package / Case | Die | 8-SOIC | 8-TSSOP | 6-TSSOP |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| RoHS | Yes | Compliant | Compliant | Compliant |
| Lifecycle Status | Obsolete | Production | Production | Production |
| Package | Die | R | MSOP | SC |
| Operating Temperature | -- | -40°C ~ 85°C | -40°C ~ 125°C | -40°C ~ 125°C |
| Supply Voltage | -- | 5 V ~ 24 V | 3 V | 2.7 V ~ 5.5 V |
| Number of Pins | -- | 8 | 8 | 6 |
| Number of Channels | -- | 1 | 2 | 1 |
| Contact Plating | -- | Tin | Tin | Gold |
| Manufacturer Lifecycle Status | -- | PRODUCTION | PRODUCTION | PRODUCTION |
| Action |
More Parts in Specialized ICs
Browse additional parts from the same category, grouped by series, package type, and manufacturer. These are catalog suggestions — not verified pin-compatible alternates.
