AMD/Xilinx XC7Z030-1FBG676C System on Chip (SoC)
IC SOC CORTEX-A9 667MHZ 676FCBGA
Same model may have multiple batches, images only for reference.
Manufacturer
Part Number (MPN)
XC7Z030-1FBG676C
Base Model
Detailed Description
IC SOC CORTEX-A9 667MHZ 676FCBGA
Package
676-BBGA, FCBGA
Key Features
Package: 676-BBGA, FCBGA
Lifecycle Status
Active
Datasheet
XC7Z030-1FBG676C Datasheet
Quick Jump:
Technical Specifications
AMD/Xilinx XC7Z030-1FBG676C System on Chip (SoC) technical specifications.
General
Series
XC7Z030
RAM Size
256kB
Maximum Clock Frequency
667 MHz
RoHS
Yes
Package / Case
676-BBGA, FCBGA
Mounting Type
SMD/SMT
Operating Temperature
0°C ~ 85°C (TJ)
Lifecycle Status
Active
Package
676-BBGA, FCBGA
Peripherals
DMA
Related Parts Comparison (XC7Z030-1FBG676C vs XC7Z030-2FBG676I vs XC7Z030-2SBG485I vs XC7Z030-1FBG484I)
Side-by-side specifications of related catalog parts.
Engineering verification required. Related parts may have different electrical ratings, pinouts, footprints, and operating limits. Verify suitability for your circuit before substitution.
| This Part | Related Part | Related Part | Related Part | |
|---|---|---|---|---|
| Series | XC7Z030 | XC7Z030 | XC7Z030 | XC7Z030 |
| Package / Case | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 484-FBGA | 484-BBGA, FCBGA |
| Mounting Type | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
| Maximum Clock Frequency | 667 MHz | 766 MHz | 766 MHz | 667 MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| RAM Size | 256kB | 256kB | 256kB | 256kB |
| RoHS | Yes | Yes | Yes | Yes |
| Lifecycle Status | Active | Active | Active | Active |
| Adaptive Logic Modules Alms | 19650 ALM | 19650 ALM | 19650 ALM | 19650 ALM |
| Architecture | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Action |
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