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AMD/Xilinx XC6SLX45-2FGG484I FPGAs (Field Programmable Gate Array)

IC FPGA 316 I/O 484FBGA

4,092 ActiveAMD/XilinxXC6SLX45FBGA$36.87RoHS
XC6SLX45-2FGG484I FBGA package illustration

Same model may have multiple batches, images only for reference.

XC6SLX45-2FGG484I
Manufacturer
Part Number (MPN)
XC6SLX45-2FGG484I
Base Model
Detailed Description
Field Programmable Gate Array (FPGA) with 43661 logic cells and 54576 registers, built on 45nm process technology. Features 316 maximum user I/Os, 2088 Kbit RAM, 116 (18x18) multipliers, and 58 dedicated DSP blocks. Operates with a 3.2 Gbps transceiver speed and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting and operating between -40°C and 100°C.
Package
FBGA
Key Features
Package: FBGA
Lifecycle Status
Active
RoHS State
RoHS Compliant
Datasheet
PDF XC6SLX45-2FGG484I Datasheet
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Ordering Code Family

XC6SLX45 groups multiple orderable suffixes under one base device. Compare package, grade, and reel options on the base-number page before substituting within the family.

84 ordering variants listed on the family page.

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Technical Specifications

AMD/Xilinx XC6SLX45-2FGG484I FPGAs (Field Programmable Gate Array) technical specifications.

General

Series
XC6SLX45
RoHS
Yes
Number of Pins
484
Package / Case
484-BBGA
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C (TJ)
Supply Voltage
1.14V ~ 1.26V
Lifecycle Status
Active
Basic Package Type
Ball Grid Array
Package Family Name
BGA

Alternate Parts Comparison (XC6SLX45-2FGG484I vs XC6SLX45-3FGG676C vs XC6SLX45-L1CSG324I vs XC6SLX45T-3FG484C)

Side-by-side technical parameter comparison of related primary models in this product family.

This PartAlternate PartsAlternate PartsAlternate Parts
Package / Case484-BBGA676-BGA324-LFBGA, CSPBGA484-BBGA
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)
Supply Voltage1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V1.14V ~ 1.26V
RoHSYesYesYesNo
Lifecycle StatusActiveActiveActiveActive
Number of I/O316358218296
Number of LABs/CLBs3411341134113411
Number of Logic Elements Cells43661436614366143661
PackageFBGA676-BGA324-LFBGA, CSPBGAFBGA
Total RAM Bits2138112213811221381122138112
SeriesXC6SLX45XC6SLX45XC6SLX45--
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AMD/Xilinx XC6SLX45-2FGG484I FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 43661 logic cells and 54576 registers, built on 45nm process technology. Features 316 maximum user I/Os, 2088 Kbit RAM, 116 (18x18) multipliers, and 58 dedicated DSP blocks. Operates with a 3.2 Gbps transceiver speed and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM.

Packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting and operating between -40°C and 100°C.

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