AMD/Xilinx XC6SLX16-3FGG676C FPGAs (Field Programmable Gate Array)

Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology.

In Stock ActiveAMD/XilinxSpartan®-6 LX XC6SLX16FBGARoHS

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XC6SLX16-3FGG676C

Manufacturer

Part Number (MPN)

XC6SLX16-3FGG676C

Category

Integrated Circuits (ICs)Embedded Processors and Controllers FPGAs (Field Programmable Gate Array)

Series

Base Model

Detailed Description

Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576 Kbit RAM, 64 (18x18) multipliers, and 32 dedicated DSP blocks. Offers 498 maximum user I/Os and 6 DLLs/PLLs. Operates with 3.2 Gbps transceiver speed and SRAM program memory. Encased in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27x27x1.73mm, suitable for surface mounting.

Package

FBGA

Key Features

Package: FBGA

Lifecycle Status

Active

RoHS State

RoHS Compliant

Datasheet

XC6SLX16-3FGG676C Datasheet

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Quality Assured

Technical Specifications

AMD/Xilinx XC6SLX16-3FGG676C FPGAs (Field Programmable Gate Array) technical specifications.

General

RoHS

Yes

Number of Pins

676

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C

Basic Package Type

Ball Grid Array

Package Family Name

BGA

Package

FBGA

Package Description

Fine Pitch Ball Grid Array

Lead Shape

Ball

Pcb

676

Alternate Parts Comparison (XC6SLX16-3FGG676C vs XC6SLX16-2CSG225I vs XC6SLX16-2CSG225C vs XC6SLX16-3CSG225C)

Side-by-side technical parameter comparison of related primary models in this product family.

	This Part	Alternate Parts	Alternate Parts	Alternate Parts
	AMD/XilinxXC6SLX16-3FGG676C	AMD/XilinxXC6SLX16-2CSG225I	AMD/XilinxXC6SLX16-2CSG225C	AMD/XilinxXC6SLX16-3CSG225C
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Operating Temperature	0°C ~ 85°C	-40°C ~ 100°C (TJ)	0°C ~ 85°C	0°C ~ 85°C
Package	FBGA	225-LFBGA, CSPBGA	CSBGA	CSBGA
Number of Pins	676	--	225	225
RoHS	Yes	--	Yes	Yes
AEC Qualified	No	--	No	No
Automotive	No	--	No	No
Basic Package Type	Ball Grid Array	--	Ball Grid Array	Ball Grid Array
Cage Code	68994	--	68994	68994
Dedicated DSP	32	--	32	32
Device Logic Cells	14579	--	14579	14579
Device Number of Dlls Plls	6	--	6	6
Action	RFQ	RFQ	RFQ	RFQ

AMD/Xilinx XC6SLX16-3FGG676C FPGAs (Field Programmable Gate Array) Overview

Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576 Kbit RAM, 64 (18x18) multipliers, and 32 dedicated DSP blocks. Offers 498 maximum user I/Os and 6 DLLs/PLLs. Operates with 3.2 Gbps transceiver speed and SRAM program memory.

Encased in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27x27x1.73mm, suitable for surface mounting.

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XC6SLX16-3FTG256I

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Field Programmable Gate Array (FPGA) featuring 14,579 logic cells and 18,224 registers.

XC6SLX16-3FTG256C

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Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology.

XC6SLX16-3CSG324C

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Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers.

XC6SLX16-2CSG225I

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XC6SLX16-3CSG225C

XC6SLX16-3CSG225C AMD/Xilinx

Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology.